Thanks
to the Enable450 newsletter, sent out by Malcolm Penn, CEO, Future
Horizons, here is a piece on the Metro450 Conference 2014, held earlier
this year in Israel.
Metro450 is an Israel-based
consortium with the goal of helping the metrology companies advance in
their fields. The consortium’s members include metrology and related
companies, as well as academics who support these companies by
performing basic research.
The conference was sponsored by the
Israeli Chief Scientist Office, Applied Materials Israel and Intel.
There were several goals for the conference: to provide an opportunity
for industry leaders as well as academicians to meet and discuss the
latest developments in the world of metrology, to present these advances
to audiences which would normally not be privy to such information, and
to learn more about the international effort in 450mm wafer technology.
Over
200 people attended this conference from Israeli companies and
academia, as well as from Europe and the United States. Israeli
companies included Applied Materials, Jordan Valley, Nova, KLA, Zeiss
Israel, and others. Academic members included researchers from the
leading Israeli universities, including the Technion, Tel-Aviv
University. and Haifa University.
European companies were
represented by ENIAC, as well as large corporations such as ASML as well
SME-based companies. The G450C consortium, based in Albany, N.Y. was
also well represented at this conference.
Some of the highlights
of the conference included scientific discussions of different metrology
methods, and their adjunct requirements, such as improved rapid wafer
movement, improved sampling methods and fast computing. Presentations
also included an overview of the advances necessary to move the industry
forward, optical CD metrology, x-ray metrology, and novel piezo-based
wafer movement.
A panel discussed various broad industry trends,
including the timeline of 450mm wafers, European programs and the
Israeli programs. International speakers discussed the European
technology model, risk mitigation of 450 through collaborations, 450
collaborative projects under ENIAC, 450mm wafer movement challenges and
metrology challenges beyond 14nm.
This second annual Metro450 conference took place this January at the Technion, Israel.
Thursday, May 8, 2014
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