At Semicon West 2014, Daniel P. Tracy, senior director, Industry Research and Statistics, SEMI, presented on SEMI Materials Outlook. He estimated that semiconductor materials will see unit growth of 6 percent or more. There may be low revenue growth in a large number of segments due to the pricing pressures and change in material.
semiconductor eequipment, he estimated ~20 percent growth this year,
following two years of spending decline. It is currently estimated at
~11 percent spending growth in 2015.
Overall, the year
to date estimate is positive growth vs. same period 2013, for units and
materials shipments, and for equipment billings.
equipment outlook, it is pointing to ~18 percent growth in equipment for
2014. Total equipment orders are up ~17 percent year-to-date.
wafer fab materials outlook, the silicon area monthly shipments are at
an all-time high for the moment. Lithography process chemicals saw -7
percent sales decline in 2013. The 2014 outlook is downward pressure on
ASPs for some chemicals. 193nm resists are approaching $600 million. ARC
has been growing 5-7 percent, respectively.
packaging materials, the Flip Chip growth drivers are a flip chip growth
of ~25 percent from 2012 to 2017 in units. There are trends toward
copper pillar and micro bumps for TSV. Future flip chip growth in
wireless products are driven by form factor and performance. BB and AP
processors are also moving to flip chip.
There has been
growth in WLP shipments. Major applications for WLP are driven by
mobile products such as smartphones and tablets. It should grow at a
CAGR of ~11 percent in units (2012-2017).
were $280 million market in 2013. Shipments of lead-free solder balls
continues to increase. Underfillls were $208 million in 2013. It
includes underfills for flip chip and packages. The increased use of
underfills for CSPs and WLPs are likely to pass the drop test in
high-end mobile devices.
Wafer-level dielectrics were
$94 million market in 2013. Materials and structures are likely to
enhance board-level reliability performance.
materials has over a dozen suppliers. Hitachi Chemical and Henkel
account for major share of total die attach market. New players are
continuing to emerge in China and Korea. Stacked-die CSP package
applications have been increasing. Industry acceptance of film
(flow)-over-wire (FOW) and dicing die attach film (DDF) technologies are