The aim of the ENIAC E450EDL key enabling technology pilot project is to continue the engagement of the European semiconductor equipment and materials industry in the 450mm wafer size transition that started with the ENIAC JU EEMI450 initiative and proceeded with subsequent projects funded with public money, amongst others NGC450, SOI450, EEM450PR.The demo line resulting from this project will be such that it will enable first critical process module development by combining imec infrastructure with tools remaining at the site of the manufacturers (distributed pilot line). Multi-site processing will allow partners to participate in the world first 450mm integration studies and will be enabled by the controlled exchange of 450mm wafers between different sites.
The consortium comprises 41 members (from 11 different European countries) with many SMEs and research institutes. The project is organized in five technical work packages and a work package on management and co-ordination.
In the work package on integration and wafer processing first critical modules will be developed and will demonstrate the feasibility of processing on 450mm wafers. The main objective in the work package on lithography is to develop a wafer stage test-rig, which can be implemented into the pilot line system.
In the work package on front end equipment several tools will be developed such as a plasma ion implant module, a plasma dry etch module, a RTP system and a single wafer cleaning system.
Furthermore, in the dedicated work package on metrology 450mm metrology tool types will be developed for amongst others dielectric film thickness and composition measurements, defect inspection, defect review and analysis, optical critical dimensions (CD), overlay (mask and wafer) and 3D metrology.
Finally, from the work package on wafer handling and automation a set of equipment will be provided to support the demo line operations, and facilitate the R&D dedicated to process and metrology modules.
The project will last 36 months beginning on 1st of October 2013. The budget has been given at €204.6 million of which the ENIAC JU will fund €30.8 million. This project is still considering new members so if you are interested please contact ASML.
The companies currently involved are
• ASML Netherlands B.V., Netherlands
• adixen Vacuum Products, France
• AIS Automation Dresden GmbH, Germany
• Applied Materials Israel Ltd., Israel
• artemis control AG, Switzerland
• ASM Belgium N.V., Belgium
• ASYS Automatic Systems GmbH & Co. KG , Germany
• CEA-Leti, France
• DEMCON, The Netherlands
• Entegris Cleaning Process (ECP) S.A.S., France
• EV Group E. Thallner GmbH, Austria
• FEI Czech Republic, s.r.o., Czech Republic
• FEI Electron Optics B.V., The Netherlands
• IBS ion beam services, France
• IDE integrated Dynamics Engineering GmbH, Germany
• Interuniversitair Micro-Electronica Centrum vzw, Belgium
• Intel Performance Learning Solutions Ltd, Ireland
• Institute of Scientific Instruments of the ASCR, v.v.i., Czech Republic
• Jordan Valley Semiconductors LTD, Israel
• KLA Tencor Corporation Israel Ltd., Israel
• LAM Research AG, Austria
• Levitech B.V., The Netherlands
• M+W Products GmbH, Germany
• Metryx Ltd, United Kingdom
• MFA Research Centre for Natural Sciences - Institute for Technical Physics and Materials Science, Hungary
• Mogema B.V., The Netherlands
• Nanoplas SAS, France
• Nova Measuring Instruments Ltd, Israel
• Prodrive B.V., The Netherlands
• Recif Technologies S.A.S., France
• Reden, The Netherlands
• Riber, France
• Semilab Semiconductor Physics Laboratory Co. Ltd., Hungary
• Semilev GmbH, Germany
• Soitec S.A., France
• SUSS Microtec AG, Germany
• TNO - Nederlandse Organisatie voor Toegepast Natuurwetenschappelijk Onderzoek, The Netherlands
• Delft University of Technology, The Netherlands
• VDL Enabling Technologies Group Eindhoven B.V., The Netherlands
• Xycarb Ceramics B.V , The Netherlands
• Carl Zeiss SMT GmbH, Germany.
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