Tensilica to expand Cadence IP footprint in SoCs

Tensilica DPU solutions are meant for broad applications. It is focusing on three key verticals — Hi-Fi audio voice, IVP imaging and Diamond controllers, as well as the Xtensa. Tensilica will expand the Cadence IP footprint in SoCs. This compliments Cadence and Cosmic Circuits interface and analog IPs.

How does all of this fit into Cadence’s vision of an IP factory? According to Chris Rowan, founder and CTO, Tensilica, there will likely be an IP bazaar, architected  for efficiency, quality and strong focus on integration. He was speaking on the concluding day of the 13th Global Electronics Summit at Santa Cruz, USA.

Complex imaging functions are now everywhere. There are some challenges here such as computational demands. The off-load opportunity means more operations, and lower power per operation.

The Tensilica IVP – image/video processing family consists of the IVP, a high-performance DSP subsystem. It is built for low energy handheld devices. It also has licensable, synthesizable core with rich software tools and libraries. The IVP core has 32 element engines. The IVP has many parallel ‘element engines’ + Xtensa control programmed as SMID  uniprocessor. Application examples include feature detection, 3D noise reduction filter, and video stabiilizer.

IVP is meeting tomorrow’s imaging requirements. It is built for very high imaging efficiency. It is easy to program and is scalable — and can use multiple cores.There is a huge market in many applications. An example of how Tensilica will fit into Cadence’s IP factory is the DTV application.

Together, Cadence and Tensilica will increase customer value. They will accelerate the time-to-market with solution proven customizable design IP. There will be fully integrated data plane solutions for optimized solutions, power and area for various applications. High quality IP subsystems are tested to work optimally together. It is highly complementary to partner CPUs. It is also highly complementary to Cadence’s broad connectivity/AMS design IP, verification IP offerings, and foundry-qualified SoC design tools.

The partnership will also bolster Cadence as a next-generation IP provider. There will be an enhanced portfolio of advanced IP in advanced nodes spanning a wide range of applications. It will address seamless designs from architecture definition to silicon tape-out. It will also strengthen solutions to address key market segments.